SDG4
NCKU, Siemens, and Otsuka Launch Partnership to Advance Semiconductor Thermal Measurement and Simulation
On July 16, NCKU Semiconductor Academy joined forces with Siemens Industry Software Taiwan and EFD Corporation (a subsidiary of Otsuka Information Technology Corp.) to host the "Semiconductor Component Measurement and Engineering Simulation Technology Talent Cultivation & Software Authorization Ceremony." Representatives from the three organizations signed the collaboration agreement on-site. Through software licensing of Simcenter Flotherm and the Simcenter 3D series of engineering simulation tools, alongside the Micred Power Tester hardware, the partnership assists the NCKU Semiconductor Academy in establishing a comprehensive platform for semiconductor component measurement and engineering simulation analysis, creating a teaching, research, and talent cultivation environment aligned with real-world industry needs.
As semiconductor and electronic products advance toward higher performance, higher power density, and miniaturization, thermal management, electronic system reliability, and engineering design verification have become crucial to product development. This collaboration introduces industry-standard measurement and simulation techniques into the campus, strengthening NCKU faculty and students' capabilities in thermal design, electronic heat dissipation, and system reliability analysis, while enabling students to become familiar with industry-grade hardware, software tools, and engineering workflows during their studies.
Wei-Chou Hsu, Dean of NCKU Semiconductor Academy, stated that the academy is committed to semiconductor research and cross-disciplinary talent development, actively bridging academic coursework with industry practice. With software and technical resources injected by Siemens and Otsuka Information, this partnership further enriches the thermal simulation teaching and research ecosystem. It allows students to transition from theoretical learning to hands-on practice, deepening their expertise in heat dissipation, structural analysis, system design, and sustainable manufacturing. Looking forward, the academy hopes to build on this collaboration to promote joint industry-academic research and innovative technological exchange.
De-ming Lin, General Manager of Siemens Industry Software Taiwan, noted that this three-party collaboration represents not only the introduction of advanced engineering simulation software, but also a significant milestone in deepening industry-academia cooperation and cultivating future engineering talent. Through Simcenter Flotherm and Simcenter 3D solutions, students can perform thermal, fluid, structural, and multiphysics analysis in a systematic manner, gaining early exposure to digital engineering methodologies used in industry. Siemens aims to leverage digital twin and engineering simulation technologies to bridge the gap between theory and practice, nurturing professionals who meet the demands of smart semiconductor and sustainable manufacturing development.
Chih-Ming Chien, CEO of EFD Corporation, expressed that Otsuka Information has long been deeply involved in engineering software integration, technical consulting, and training services. Through this partnership, the company aims to bring accumulated industry experience onto campus. Beyond assisting NCKU in completing the software platform setup, EFD will continuously offer educational training, technical support, and application case studies. This ensures faculty and students not only master advanced tools, but also gain deep insight into the practical applications of Siemens software and hardware in semiconductor thermal management, electronic product design, and sustainable manufacturing, thereby enhancing students' career readiness and industry alignment.
This collaboration marks a new milestone for NCKU, Siemens, and Otsuka Information in nurturing talent for smart semiconductors and sustainable manufacturing. By integrating software resources, industrial expertise, and academic research capabilities, the three parties look forward to creating a more competitive engineering education environment, narrowing the skill gap between academia and industry, and cultivating more outstanding talent with cross-domain integration and practical application skills for Taiwan's semiconductor, electronics, and smart manufacturing industries over the long term.
Academician Kang Lung Wang, Honorary Dean of NCKU Semiconductor Academy (front row, third from right), attended the ceremony to witness the event and took a photo with the three-party team.
Chih-Ming Chien, CEO of EFD Corporation (Otsuka Information Group), explained the motivation behind the three-party collaboration.
De-ming Lin, General Manager of Siemens Industry Software Taiwan, emphasized the importance of talent cultivation.
NCKU Semiconductor Academy Partners with Siemens and Otsuka in Industry-Academia Collaboration, Introducing Component Thermal Characterization and Engineering Simulation Technologies to Boost Industry Readiness (From left: De-ming Lin, General Manager of Siemens Industry Software Taiwan; Wei-Chou Hsu, Dean of NCKU Semiconductor Academy; Chih-Ming Chien, CEO of EFD Corporation, Otsuka Information Group)
Wei-Chou Hsu, Dean of NCKU Semiconductor Academy, hopes this three-party collaboration will open the door to further exchanges.
