SDG17
The 9th Materials Science and Engineering Industry Forum: "A Decade of Refinement, Advanced Packaging Empowering AI"
The "Materials Science and Engineering Industry Forum," hosted by the Department of Materials Science and Engineering and its Alumni Association of National Cheng Kung University (NCKU) during the university's anniversary celebration, has become a significant annual event in Taiwan's materials industry. This year, the 9th forum took place on November 8, 2024, at the NCKU Library International Conference Hall under the theme "A Decade of Refinement: Advanced Packaging Driving AI." The forum explored the innovative applications and leading-edge developments of advanced packaging technologies driven by AI. The event attracted nearly 400 participants, including 200 outstanding leaders and professionals from the semiconductor supply chain, entrepreneurs, seasoned industry media, academics, and financial experts at the main venue, as well as attendees at a secondary location and online participants. Together, they delved into and shared new ideas in advanced packaging technology.
In his opening remarks, Professor Hao-Zhi Liu, Chair of the Department of Materials Science and Engineering, highlighted that the success of the forum each year relies on the collective efforts of numerous alumni and organizers. He expressed gratitude to alumni for inviting industry leaders to share their expertise, offering invaluable opportunities for students and faculty to gain in-depth understanding of materials, related processes, and equipment. He noted that this year's forum was closely aligned with current industry trends and future developments, ensuring participants would gain significant insights.
Wei-Wen Yang, President of the Alumni Association and General Manager of CISTECH, emphasized that every step of semiconductor manufacturing relies on materials applications, and equipment design and development are intrinsically linked to precise materials management. He noted that as a vital hub for cultivating materials talent in Taiwan, the department's annual forum has become one of the industry's most important events. This year, the forum aimed to initiate discussions on key processes, drive equipment innovation, and deeply explore the critical role and future trends of advanced packaging in AI chip development. The goal was to share the latest advancements and innovative ideas from leading companies with academia and industry, fostering collaboration and exchange.
On behalf of the university, NCKU Vice President for Research and Development, Quan-Pu Liu, welcomed and thanked alumni and guests for their attendance. He shared President Meng-Ru Shen's vision of transforming NCKU into a world-class university that contributes significantly to the nation, society, and economy. Achieving this requires strong connections with the real world. Liu highlighted that the participating speakers represent Taiwan's vital industries and global trends, providing students with insights into industry dynamics. NCKU aims to cultivate talents who excel in both academia and industry, thereby enhancing societal impact.
Chi-Hung Chen, President of the NCKU Global Alumni Association, also expressed high praise for the forum, stating that it has established NCKU as a key influencer in societal impact and demonstrated the university's strong ties with the industry.
This year’s forum featured five industry experts. The first speaker, NCKU alumnus Shang-Yung Hou, Director of the High-Performance Packaging Integration Division at TSMC, delivered a talk titled "Chiplet Integration Technology in the Era of AI," discussing opportunities and challenges in the semiconductor industry amidst the rapid expansion of AI applications. He highlighted TSMC's pioneering CoWoS packaging technology as a solution for meeting AI chip performance demands and overcoming wafer fabrication challenges, stressing that innovation and collaboration are essential for capitalizing on AI's transformative wave.
NCKU alumnus Cheng-Yen Chiang, COO of Winstek Semiconductor, presented "Chip Cooling: Ingeniously Combining Materials and Mechanics," elaborating on the company’s role in advanced packaging. Stone Shih, CEO of Grand Process Technology Corporation, shared insights on "Opportunities and Challenges in Domestic Semiconductor Equipment," detailing his leadership in expanding into process materials and automation equipment. Fellow alumnus Stone Tung-Chih, CEO of TS Precision Technology, explored "Precision Placement Technology in Advanced Semiconductor Packaging," while Eric Hung, Chairman of InnoBridge Technology, offered an entrepreneurial perspective with his talk, "An Engineer’s Approach to Startup Choices: Differentiating Problem-Solving Businesses," outlining three principles for innovative product development.
The panel discussion was moderated by David L. Yu, Group Vice President and Taiwan President of Applied Materials. Summarizing the forum’s core takeaways, Yu emphasized the importance of fostering collaboration to embrace opportunities and challenges brought by AI advancements. He remarked that future innovations require not only technological progress but also a shift in mindset. Yu underscored the transformative potential of advanced packaging technologies in enhancing AI chip performance and driving industry upgrades.
Since 2015, the "Materials Science and Engineering Industry Forum" has been jointly organized by the department and its alumni association, except for a hiatus during the COVID-19 pandemic. Held annually in November as part of the university’s anniversary celebrations, the forum has become a key event to commemorate the department’s contributions to the field. Each year, the forum addresses themes of long-term significance to Taiwan’s industries, fostering in-depth exploration and sharing among industry and academia while encouraging innovation and collaboration. Past topics include "Industry 4.0 and the Red Supply Chain," "Taiwan Enterprises’ Path: Innovation and Strategy," "Entrepreneurship and Interdisciplinary Integration," "The Next Decade: Revitalizing Taiwan’s Industries and Talent," "AI and Industrial Development," "Advanced Semiconductor Design and Manufacturing: Taiwan’s Century," "Innovations and Applications in Metal Materials," and "Sustainable Energy Transition and the New Economy: Innovations in Green Technology."
In his opening remarks, Professor Hao-Zhi Liu, Chair of the Department of Materials Science and Engineering, highlighted that the success of the forum each year relies on the collective efforts of numerous alumni and organizers. He expressed gratitude to alumni for inviting industry leaders to share their expertise, offering invaluable opportunities for students and faculty to gain in-depth understanding of materials, related processes, and equipment. He noted that this year's forum was closely aligned with current industry trends and future developments, ensuring participants would gain significant insights.
Wei-Wen Yang, President of the Alumni Association and General Manager of CISTECH, emphasized that every step of semiconductor manufacturing relies on materials applications, and equipment design and development are intrinsically linked to precise materials management. He noted that as a vital hub for cultivating materials talent in Taiwan, the department's annual forum has become one of the industry's most important events. This year, the forum aimed to initiate discussions on key processes, drive equipment innovation, and deeply explore the critical role and future trends of advanced packaging in AI chip development. The goal was to share the latest advancements and innovative ideas from leading companies with academia and industry, fostering collaboration and exchange.
On behalf of the university, NCKU Vice President for Research and Development, Quan-Pu Liu, welcomed and thanked alumni and guests for their attendance. He shared President Meng-Ru Shen's vision of transforming NCKU into a world-class university that contributes significantly to the nation, society, and economy. Achieving this requires strong connections with the real world. Liu highlighted that the participating speakers represent Taiwan's vital industries and global trends, providing students with insights into industry dynamics. NCKU aims to cultivate talents who excel in both academia and industry, thereby enhancing societal impact.
Chi-Hung Chen, President of the NCKU Global Alumni Association, also expressed high praise for the forum, stating that it has established NCKU as a key influencer in societal impact and demonstrated the university's strong ties with the industry.
This year’s forum featured five industry experts. The first speaker, NCKU alumnus Shang-Yung Hou, Director of the High-Performance Packaging Integration Division at TSMC, delivered a talk titled "Chiplet Integration Technology in the Era of AI," discussing opportunities and challenges in the semiconductor industry amidst the rapid expansion of AI applications. He highlighted TSMC's pioneering CoWoS packaging technology as a solution for meeting AI chip performance demands and overcoming wafer fabrication challenges, stressing that innovation and collaboration are essential for capitalizing on AI's transformative wave.
NCKU alumnus Cheng-Yen Chiang, COO of Winstek Semiconductor, presented "Chip Cooling: Ingeniously Combining Materials and Mechanics," elaborating on the company’s role in advanced packaging. Stone Shih, CEO of Grand Process Technology Corporation, shared insights on "Opportunities and Challenges in Domestic Semiconductor Equipment," detailing his leadership in expanding into process materials and automation equipment. Fellow alumnus Stone Tung-Chih, CEO of TS Precision Technology, explored "Precision Placement Technology in Advanced Semiconductor Packaging," while Eric Hung, Chairman of InnoBridge Technology, offered an entrepreneurial perspective with his talk, "An Engineer’s Approach to Startup Choices: Differentiating Problem-Solving Businesses," outlining three principles for innovative product development.
The panel discussion was moderated by David L. Yu, Group Vice President and Taiwan President of Applied Materials. Summarizing the forum’s core takeaways, Yu emphasized the importance of fostering collaboration to embrace opportunities and challenges brought by AI advancements. He remarked that future innovations require not only technological progress but also a shift in mindset. Yu underscored the transformative potential of advanced packaging technologies in enhancing AI chip performance and driving industry upgrades.
Since 2015, the "Materials Science and Engineering Industry Forum" has been jointly organized by the department and its alumni association, except for a hiatus during the COVID-19 pandemic. Held annually in November as part of the university’s anniversary celebrations, the forum has become a key event to commemorate the department’s contributions to the field. Each year, the forum addresses themes of long-term significance to Taiwan’s industries, fostering in-depth exploration and sharing among industry and academia while encouraging innovation and collaboration. Past topics include "Industry 4.0 and the Red Supply Chain," "Taiwan Enterprises’ Path: Innovation and Strategy," "Entrepreneurship and Interdisciplinary Integration," "The Next Decade: Revitalizing Taiwan’s Industries and Talent," "AI and Industrial Development," "Advanced Semiconductor Design and Manufacturing: Taiwan’s Century," "Innovations and Applications in Metal Materials," and "Sustainable Energy Transition and the New Economy: Innovations in Green Technology."
The 9th Cheng Tai Industry Forum was held on the 8th. Yang Weiwen (5th from the left), President of the NCKU Materials Alumni Association, presented a certificate of appreciation to the speakers of this session.
Liu Haozhi, Chair of the Department of Materials Science and Engineering at NCKU, expressed gratitude to the alumni for inviting industry leaders to share their insights, providing valuable opportunities for exchange between faculty and students.
President Wei-Wen Yang hopes that the event will bring the latest developments and innovative ideas from leading companies in advanced packaging to academia and industry, while also fostering exchange and collaboration.
Alumnus of the Department of Materials Science and Engineering and TSMC's Director of High-Performance Package Integration, Shang-Yung Hou, shared insights on "Chiplet Integration Technology in the Era of Artificial Intelligence."
David Luh, Group Vice President and President of Applied Materials Taiwan, moderated the panel discussion, which featured lively and engaging conversations.
The 9th Materials Science and Engineering Industry Forum attracted nearly 400 participants, coming together to explore and share new perspectives on advanced packaging technologies.
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