SDG17
NCKU Collaborate with Tokyo Tech, NARLabs TSRI to Leading the Semiconductor Heterogeneous Integration of Next Generation
Written by NCKU Office of Internation Affairs. Image credit to NCKU News Center.
As the technology for reducing chip sizes approaches its physical limits, advanced packaging with heterogeneous integration has become critical for the continued development of semiconductor technology. Facilitated by National Cheng Kung University (NCKU), the tripartite partnership of the Tokyo Institute of Technology (TIT/Tokyo Tech), the Taiwan Semiconductor Research Institute, (NARLabs TSRI), and NCKU further strengthens academic capabilities and industrial links based on existing collaboration, aiming to strengthen the competitiveness of the semiconductor industry and cultivate high-level talents in order to meet the needs and challenges of the technological development of the New AI Era.
Chair Prof. Meng-Ru Shen, President of NCKU, Prof. Kazuya Masu, President of Tokyo Tech, and Dr. Tuo-Hung Hou, Director General of NARLabs TSRI have made a joint declaration in the Taiwan-Japan Forum on Next Generation Heterogeneous Integration Technology co-organized by the three parties on July 11th 2024.
Combining Taiwan’s solid and leading semiconductor manufacturing process and supply chain with Japan’s advantages in materials and equipment, this Taiwan-Japan trilateral collaboration complements the cross-border strengths of researchers and connects the two countries’ technology companies to build a supply chain, which is conducive to accelerating breakthroughs in industrial technology. Taiwan and Japan have joined hands to remain on the leading edge of semiconductor technology. The honorable guests attending the ceremony also included Tokyo Tech’s Prof. Kentaro Nakamura, Director of Future Interdisciplinary Research in Science and Technology (FIRST); Prof. Takayuki Ohba, Leader of Wafer-on-Wafer (WOW) Alliance; Deputy Director General Ying-Zong Juang of NARLabs TSRI; Executive Vice President Hong-Chen Chen of NCKU; Chair Prof. Yan-Kuin Su, Dean of Academy of Innovative Semiconductor and Sustainable Manufacturing (AISSM); Distinguished Prof. Yu-Lung Lo, Assoc. Dean of AISSM; Distinguished Prof. Wei-Chou Hsu, Assoc. Dean of AISSM; Chair Prof. Sun-Yuan Hsieh, Vice President for International Affairs; and Prof. Sherry Shu-Jung Hu, Assoc. Vice President for International Affairs.
NCKU President Meng-Ru Shen emphasized that NCKU have been actively fostering industry-academia collaborations, including the NCKU-TSMC Joint Research Center and the Joint Research Center with corporations such as the ASE Technology and Delta Electronics. NCKU’s Innovation Headquarters and Tokyo Tech’s WOW (Wafer-on-Wafer) Alliance formed a technical partnership in 2022, while NARLabs TSRI has been offering technical support in semiconductor IC production and processes for many NCKU faculty members. President Shen is delighted to see existing collaboration form a solid foundation for the tripartite partnership and hopes the alliance would accelerate advancements in semiconductor technology. Through today’s forum, besides bringing together academics and professionals of Taiwan and Japan, he also expects the mutual exchange will inspire new insights and contribute to the advancement of next-generation technologies.
President Kazuya Masu of Tokyo Tech pointed out the importance and the crucial role of the semiconductor technology in areas including communications, AI, and social infrastructures like medicine and healthcare. He believes that in collaboration with Taiwan, whose semiconductor sector is highly competitive, will promote continuous advancement of the technology and industry in the future. President Masu also mentioned his own special feelings toward Taiwan, where his father was born and had spent more than a decade living in. He underlined the “same origin” that Tokyo Tech and NCKU share, as both institutions were first established as Technical Colleges, and concluded by expressing his gratitude to visit NCKU and Tainan for the first time through this forum.
Dr. Tuo-Hung Hou, Director General of NARLabs TSRI also mentioned that advanced packaging is the crucial technology for next-generation communications, high-performance computing (HPC) and Artificial Intelligence of Things (AIoT) applications. The NARLabs TSRI is not only a service provider for Taiwan's semiconductor industry and academia, but has also been actively developing open information and service platforms in fields of related technical services. The tripartite collaboration with NCKU and Tokyo Tech brings possibility of further technical cooperation based on existing partnerships of the three parties, to introduce the expertise in semiconductor equipment and materials of Japan, and assist the NARLabs TSRI and NCKU in establishing advanced stacked packaging verification technology for large-scale integration and more wafers, allowing domestic industry, academia and research teams to share resources and shorten the time of technology development and verification. This will be an accelerating engine not only for the academia and industrial teams to integrate current mainstream logic IC and memory chips, but also for the development of combining heat dissipation technology together with chip module research of integrating passive components, power management, and sensing, so as to cultivate holistic executive practical talents.
Broadly speaking, advanced packaging with heterogeneous integration is the integration of different chips through packaging and 3D stacking technology, so that the chips can maintain a small size while handling complex tasks swiftly and efficiently, which is crucial to the development of AI.
NCKU has profound research capabilities in areas like engineering and computer science. NCKU is also the first university in the country establishing the Academy of Innovative Semiconductor and Sustainable Manufacturing based on our national development policies, with abundant achievements in academia-industrial collaborations. Tokyo Institute of Technology is a leading comprehensive university in Japan known for its excellence in science and technology. Its WOW Alliance signed an agreement with NCKU's Innovation Headquarters in 2022 to develop its advanced packaging technologies in Taiwan.
Taiwan Semiconductor Research Institute (NARLabs TSRI) is a leading semiconductor research and technology service provider. Through the tripartite collaboration, NCKU and NARLabs TSRI expect to leverage Japanese semiconductor equipment and materials to prompt research units in Taiwan and Japan to establish advanced stack packaging verification technology for large areas and more wafers, making the most of cross-border cooperation.
After the declaration ceremony of NCKU - TIT - NARLabs TSRI’s tripartite collaboration came to an end, the 2024 Taiwan-Japan Forum on Next Generation Heterogeneous Integration Technology came on stage. Guest speech by Tokyo Tech President Kazuya Masu: “Global Collaboration in Semiconductor Innovation: Creating the Future with National Cheng Kung University and Tokyo Institute of Technology” marked the commencement of the forum. The one-day forum attracted around 150 academics, researchers and industry professionals from Taiwan and Japan to share the latest developments in related technologies.
Provider: NCKU News Center
Date: 2024-07-15
As the technology for reducing chip sizes approaches its physical limits, advanced packaging with heterogeneous integration has become critical for the continued development of semiconductor technology. Facilitated by National Cheng Kung University (NCKU), the tripartite partnership of the Tokyo Institute of Technology (TIT/Tokyo Tech), the Taiwan Semiconductor Research Institute, (NARLabs TSRI), and NCKU further strengthens academic capabilities and industrial links based on existing collaboration, aiming to strengthen the competitiveness of the semiconductor industry and cultivate high-level talents in order to meet the needs and challenges of the technological development of the New AI Era.
Chair Prof. Meng-Ru Shen, President of NCKU, Prof. Kazuya Masu, President of Tokyo Tech, and Dr. Tuo-Hung Hou, Director General of NARLabs TSRI have made a joint declaration in the Taiwan-Japan Forum on Next Generation Heterogeneous Integration Technology co-organized by the three parties on July 11th 2024.
Combining Taiwan’s solid and leading semiconductor manufacturing process and supply chain with Japan’s advantages in materials and equipment, this Taiwan-Japan trilateral collaboration complements the cross-border strengths of researchers and connects the two countries’ technology companies to build a supply chain, which is conducive to accelerating breakthroughs in industrial technology. Taiwan and Japan have joined hands to remain on the leading edge of semiconductor technology. The honorable guests attending the ceremony also included Tokyo Tech’s Prof. Kentaro Nakamura, Director of Future Interdisciplinary Research in Science and Technology (FIRST); Prof. Takayuki Ohba, Leader of Wafer-on-Wafer (WOW) Alliance; Deputy Director General Ying-Zong Juang of NARLabs TSRI; Executive Vice President Hong-Chen Chen of NCKU; Chair Prof. Yan-Kuin Su, Dean of Academy of Innovative Semiconductor and Sustainable Manufacturing (AISSM); Distinguished Prof. Yu-Lung Lo, Assoc. Dean of AISSM; Distinguished Prof. Wei-Chou Hsu, Assoc. Dean of AISSM; Chair Prof. Sun-Yuan Hsieh, Vice President for International Affairs; and Prof. Sherry Shu-Jung Hu, Assoc. Vice President for International Affairs.
NCKU President Meng-Ru Shen emphasized that NCKU have been actively fostering industry-academia collaborations, including the NCKU-TSMC Joint Research Center and the Joint Research Center with corporations such as the ASE Technology and Delta Electronics. NCKU’s Innovation Headquarters and Tokyo Tech’s WOW (Wafer-on-Wafer) Alliance formed a technical partnership in 2022, while NARLabs TSRI has been offering technical support in semiconductor IC production and processes for many NCKU faculty members. President Shen is delighted to see existing collaboration form a solid foundation for the tripartite partnership and hopes the alliance would accelerate advancements in semiconductor technology. Through today’s forum, besides bringing together academics and professionals of Taiwan and Japan, he also expects the mutual exchange will inspire new insights and contribute to the advancement of next-generation technologies.
President Kazuya Masu of Tokyo Tech pointed out the importance and the crucial role of the semiconductor technology in areas including communications, AI, and social infrastructures like medicine and healthcare. He believes that in collaboration with Taiwan, whose semiconductor sector is highly competitive, will promote continuous advancement of the technology and industry in the future. President Masu also mentioned his own special feelings toward Taiwan, where his father was born and had spent more than a decade living in. He underlined the “same origin” that Tokyo Tech and NCKU share, as both institutions were first established as Technical Colleges, and concluded by expressing his gratitude to visit NCKU and Tainan for the first time through this forum.
Dr. Tuo-Hung Hou, Director General of NARLabs TSRI also mentioned that advanced packaging is the crucial technology for next-generation communications, high-performance computing (HPC) and Artificial Intelligence of Things (AIoT) applications. The NARLabs TSRI is not only a service provider for Taiwan's semiconductor industry and academia, but has also been actively developing open information and service platforms in fields of related technical services. The tripartite collaboration with NCKU and Tokyo Tech brings possibility of further technical cooperation based on existing partnerships of the three parties, to introduce the expertise in semiconductor equipment and materials of Japan, and assist the NARLabs TSRI and NCKU in establishing advanced stacked packaging verification technology for large-scale integration and more wafers, allowing domestic industry, academia and research teams to share resources and shorten the time of technology development and verification. This will be an accelerating engine not only for the academia and industrial teams to integrate current mainstream logic IC and memory chips, but also for the development of combining heat dissipation technology together with chip module research of integrating passive components, power management, and sensing, so as to cultivate holistic executive practical talents.
Broadly speaking, advanced packaging with heterogeneous integration is the integration of different chips through packaging and 3D stacking technology, so that the chips can maintain a small size while handling complex tasks swiftly and efficiently, which is crucial to the development of AI.
NCKU has profound research capabilities in areas like engineering and computer science. NCKU is also the first university in the country establishing the Academy of Innovative Semiconductor and Sustainable Manufacturing based on our national development policies, with abundant achievements in academia-industrial collaborations. Tokyo Institute of Technology is a leading comprehensive university in Japan known for its excellence in science and technology. Its WOW Alliance signed an agreement with NCKU's Innovation Headquarters in 2022 to develop its advanced packaging technologies in Taiwan.
Taiwan Semiconductor Research Institute (NARLabs TSRI) is a leading semiconductor research and technology service provider. Through the tripartite collaboration, NCKU and NARLabs TSRI expect to leverage Japanese semiconductor equipment and materials to prompt research units in Taiwan and Japan to establish advanced stack packaging verification technology for large areas and more wafers, making the most of cross-border cooperation.
After the declaration ceremony of NCKU - TIT - NARLabs TSRI’s tripartite collaboration came to an end, the 2024 Taiwan-Japan Forum on Next Generation Heterogeneous Integration Technology came on stage. Guest speech by Tokyo Tech President Kazuya Masu: “Global Collaboration in Semiconductor Innovation: Creating the Future with National Cheng Kung University and Tokyo Institute of Technology” marked the commencement of the forum. The one-day forum attracted around 150 academics, researchers and industry professionals from Taiwan and Japan to share the latest developments in related technologies.
Provider: NCKU News Center
Date: 2024-07-15
（Left to right）Yan-Kuin Su, Dean of National Cheng Kung University’s Academy of Innovative Semiconductor and Sustainable Manufacturing, Tuo-Hung Hou, Director General of NARLabs TSRI, Meng-Ru Shen, President of National Cheng Kung University, Kazuya Masu, President of Tokyo Institute of Technology
President Meng-Ru Shen hopes that the exchange of Taiwan and Japan’s academics and professionals will inspire new insights and contribute to the advancement of next-generation technologies
President Kazuya Masu of TIT delivered a speech on “Global Collaboration in Semiconductor Innovation: Creating the Future with National Cheng Kung University and Tokyo Institute of Technology”
Dr. Tuo-Hung Hou, Director General of NARLabs TSRI also mentioned that advanced packaging is the crucial technology for next-generation communications, high-performance computing (HPC) and Artificial Intelligence of Things (AIoT) applications
Group photo
During the forum
