SDG8
Innovation Headquarters, NCKU and Tokyo Institute of Technology Signed the Letter of Intent
Innovation Headquarters, NCKU and Tokyo Institute of Technology Signed the Letter of Intent
Cooperated to Accelerate the 3D Stacked Semiconductor Skill of the Next Generation
With the development of advanced semiconductor technology microminiaturization, improving the manufacturing process skill will be the key to production yield rate. To cope with the urgent needs of semiconductor skill development, Innovation Headquarters, NCKU signed the Letter of Intent with Tech Extension（TEX）, which is the derivative start-up company of WOW alliance of Tokyo Institute of Technology, and they formed an alliance called BBCube. The Innovation Headquarters will participate in the WOW alliance and conduct the research and development of 3D semiconductor technology of the next generation. In the future, BBCube will have the permission to use the manufacturing process, facilities, and materials which were developed by the WOW alliance. With the power of the WOW alliance and BBCube alliance, the supply chain of semiconductor will be strengthened, and the development of a new generation of 3D semiconductor skill microminiaturization will be promoted.
The Wafer-on-Wafer (WOW) Alliance is the industry-academia platform operated by Takayuki Ohba, the professor of the Laboratory for Future Interdisciplinary Research of Science and Technology, Tokyo Institute of Technology. It mainly consists of semiconductor-related companies and research institutions.
The WOW alliance founded the company of Tech Extension in 2018, which is regarded as the derivative start-up company of Tokyo Institute of Technology. Its purpose is to transfer the research results and technology to their cooperation companies. Innovation Headquarters, NCKU signed the Letter of Intent with TEX in July and formed an alliance called Bumpless Build Cube (BBCube). In the future, the WOW alliance will offer their research results to the BBCube alliance through TEX Taiwan, the subsidiary company of TEX in Taiwan.
Professor Takayuki Ohba, who conducts the operation of the WOW alliance indicated that the BBCube alliance will set up a WOW/COW technology test line based on BBCube’s infrastructure in NCKU. This production line will consistently achieve wafer-level small chip stack integration, not only to achieve the front-end verification, but also a one-stop to the back-end verification of each item.
So far, many universities and related companies joined the WOW alliance and are conducting the research and development of 3D semiconductor technology of the next generation. Through the BBCube alliance between Taiwan and Japan, they plan to strengthen the future supply chain of semiconductor and progress the 3D package technology in the field of semiconductor microminiaturization.
The WOW alliance is the only alliance which developed 3D technology. It uses 300mm wafers for actual development support, possesses the technology of simple wafer thinning and stacking technology, and successfully develops the 3D technology with no-bump TSV which is the first success in the world. The BBCube developed by the WOW alliance achieves the shortest design for all component devices (memory, CPU, capacitors, etc.). For example, the distance between capacitors and devices can be reduced from millimeters to microns. The WOW alliance is promoting a design that includes thermal dissipation, including development process, devices and materials, and further miniaturization to thumb-sized designs.
Cooperated to Accelerate the 3D Stacked Semiconductor Skill of the Next Generation
With the development of advanced semiconductor technology microminiaturization, improving the manufacturing process skill will be the key to production yield rate. To cope with the urgent needs of semiconductor skill development, Innovation Headquarters, NCKU signed the Letter of Intent with Tech Extension（TEX）, which is the derivative start-up company of WOW alliance of Tokyo Institute of Technology, and they formed an alliance called BBCube. The Innovation Headquarters will participate in the WOW alliance and conduct the research and development of 3D semiconductor technology of the next generation. In the future, BBCube will have the permission to use the manufacturing process, facilities, and materials which were developed by the WOW alliance. With the power of the WOW alliance and BBCube alliance, the supply chain of semiconductor will be strengthened, and the development of a new generation of 3D semiconductor skill microminiaturization will be promoted.
The Wafer-on-Wafer (WOW) Alliance is the industry-academia platform operated by Takayuki Ohba, the professor of the Laboratory for Future Interdisciplinary Research of Science and Technology, Tokyo Institute of Technology. It mainly consists of semiconductor-related companies and research institutions.
The WOW alliance founded the company of Tech Extension in 2018, which is regarded as the derivative start-up company of Tokyo Institute of Technology. Its purpose is to transfer the research results and technology to their cooperation companies. Innovation Headquarters, NCKU signed the Letter of Intent with TEX in July and formed an alliance called Bumpless Build Cube (BBCube). In the future, the WOW alliance will offer their research results to the BBCube alliance through TEX Taiwan, the subsidiary company of TEX in Taiwan.
Professor Takayuki Ohba, who conducts the operation of the WOW alliance indicated that the BBCube alliance will set up a WOW/COW technology test line based on BBCube’s infrastructure in NCKU. This production line will consistently achieve wafer-level small chip stack integration, not only to achieve the front-end verification, but also a one-stop to the back-end verification of each item.
So far, many universities and related companies joined the WOW alliance and are conducting the research and development of 3D semiconductor technology of the next generation. Through the BBCube alliance between Taiwan and Japan, they plan to strengthen the future supply chain of semiconductor and progress the 3D package technology in the field of semiconductor microminiaturization.
The WOW alliance is the only alliance which developed 3D technology. It uses 300mm wafers for actual development support, possesses the technology of simple wafer thinning and stacking technology, and successfully develops the 3D technology with no-bump TSV which is the first success in the world. The BBCube developed by the WOW alliance achieves the shortest design for all component devices (memory, CPU, capacitors, etc.). For example, the distance between capacitors and devices can be reduced from millimeters to microns. The WOW alliance is promoting a design that includes thermal dissipation, including development process, devices and materials, and further miniaturization to thumb-sized designs.
